this is information on a product in full production. april 2014 docid025910 rev 1 1/8 EMIF06-USD05F3 6-line emi filter and esd protection for sd card, mini-sd card and micro-sd card interfaces datasheet ? production data features ? emi low-pass filter ? 104 mhz clock frequency compatible with sdr50 mode (sd3.0) ? high attenuation level of -30 db at 900 mhz ? lead-free package complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) applications where emi filtering in esd sensitive equipment is required: ? features phones, smartphones, phablets and communication systems ? tablets, multimedia players like mp3, camcorders tm : ipad is a trademark of stmicroelectronics description the EMIF06-USD05F3 is a 6-line emi filter dedicated to sd, mini-sd and micro-sd card applications. it provides an efficient attenuation at 900 mhz to reduce or suppress the antenna de- sense. this filter includes esd protection circuitry, which prevents damage to the protected device when inserting the card. pull-up resistors are not integrated inside the chip, hence the EMIF06-USD05F3 gives the flexibility to customers to use controllers with embedded resistance. this 6-line ipad ? is packaged into a flip-chip solution, saving pcb space . figure 1. pin configuration (bump side) flip chip (15 bumps) 1 2 3 4 a b c d www.st.com
characteristics EMIF06-USD05F3 2/8 docid025910 rev 1 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd discharge iec 61000-4-2, level 4 air discharge card side contact discharge card side air discharge ic side contact discharge ic side 15 8 2 2 kv t j maximum junction temperature 125 c t op operating temperature range - 30 to + 85 c t stg storage temperature range - 55 to + 150 c table 2. electrical characteristics (values, t amb = 25 c) symbol parameter test conditions min. typ. max. unit v br breakdown voltage i r = 1 ma 6 v i rm leakage current at v rm v rm = 3 v 100 na r line serial line resistor 32 40 48 c line total line capacitance v bias = 2.4 v 11 14 pf f c -3db cut-off frequency z source = z load = 50 ? 300 mhz s 21 attenuation f = 900 mhz -25 -30 db symbol parameter v = breakdown voltage v = stand-off voltage br rm i = leakage current at v rm rm = line capacitance c line v i v cl v br v rm i rm i pp
docid025910 rev 1 3/8 EMIF06-USD05F3 characteristics 8 figure 3. functional schematic table 3. pin configuration pin signal pin signal a1 dat0 c1 cmd a2 dat1 c2 a3 sddat1 c3 gnd a4 sddat0 c4 sdcmd b1 clk d1 dat3 b2 v cc d2 dat2 b3 gnd d3 sddat2 b4 sdclk d4 sddat3 cmd dat0 clk dat1 dat2 dat3 sdcmd sddat0 sdclk sddat1 sddat2 sddat3 r gnd vcc
characteristics EMIF06-USD05F3 4/8 docid025910 rev 1 figure 4. attenuation versus frequency figure 5. line capacitance versus applied voltage s21(db) 10m 30m 100m 300m 1g 3g -50 -45 -40 -35 -30 -25 -20 -15 -10 -5 0 dat0 dat1 dat2 dat3 clk cmd f(hz) 0 0123456 2 4 6 8 10 12 14 16 c line (pf) v bias (v) figure 6. analog crosstalk versus frequency figure 7. digital crosstalk measurements 10m 30m 100m 300m 1g 3g -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 dat0/clk dat2/dat1 clk/vcc xtalk(db) f(hz) figure 8. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 9. esd response to iec 61000-4-2 (-8 kv contact discharge) 5.0 v / div v : peak clamping voltage cl v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 20 ns / div 14.8 v 1 10.1 v 9 v 5.9 v 2 4 3 2.0 v / div v : peak clamping voltage cl v :clamping voltage @ 30 ns cl v :clamping voltage @ 60 ns cl v :clamping voltage @ 100 ns cl 1 2 3 4 20 ns / div -2.58 v -1.15 v 4 3 -8.90 v 1 -3.16 v 2
docid025910 rev 1 5/8 EMIF06-USD05F3 package information 8 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions figure 11. footprint figure 12. marking 1.58 mm 40 m 1.58 mm 40 m 255 m 40 400 m 40 400 m 40 190 m 10 190 m 10 500 m 50 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y z w x w dot, st logo ecopack status xx = marking yww = datecode y = year, ww = week z = manufacturing location
package information EMIF06-USD05F3 6/8 docid025910 rev 1 figure 13. tape and reel specification note: more information is available in the stmicroelectronics application notes: an2348: ?flip chip: package description and recommendations for use? an1751: ?emi filters: recommendations and measurements? dot identifying pin a1 location user direction of unreeling all dimensionsare in mm 4.0 0.1 4.0 0.1 2.0 0.05 8.0 +0.3/-0.1 1.75 0.1 3.5 0.05 ? 1.55 0.05 0.59 0.05 1.69 0.05 0.20 0.02 st st st xxz yww xxz yww xxz yww e e e 1.69 0.05 st st st xxz yww xxz yww xxz yww e e e
docid025910 rev 1 7/8 EMIF06-USD05F3 ordering information 8 3 ordering information figure 14. ordering information scheme 4 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF06-USD05F3 kt flip chip 2.6 mg 5000 tape and reel 7? emif 06 - u 5 sd 0 f3 emi ilter f number of lines application um c sd = icro sd ard version 0= 5 design version package f = flip chip 3= ead free itch = 400 m, ump = 255 m l-, p b table 5. document revision history date revision changes 25-apr-2014 1 first issue.
EMIF06-USD05F3 8/8 docid025910 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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